| 描述 | 標準 | 進階 |
|---|---|---|
| Min.Trace/Space | 1.5mils / 1.5mils | 1.2mils / 1.5mils |
| Min. Copper Thickness | 1/3oz | 1/7 oz |
| Max. Copper Thickness | 10oz | 12oz |
| Min. Core Thickness | 5mils | 3mils |
| Line/ pad to drill hole | 6mils | 4mils |
| Line/ pad to board edge | 8mils | 6mils |
| Line Tolerance | +/-10% | +/-8% |
| 描述 | 標準 | 進階 |
|---|---|---|
| Max. Finish Board Size | 19”X26” | 20”X28” |
| min. Finish Board Size | 0.2"x0.2" | 0.15"*0.15" |
| Max. Board Thickness | 0.260"(+/-10%) | 0.280"(+/-8%) |
| Min. Board Thickness | 0.007"(+/-10%) | 0.005"(+/-10%) |
| 描述 | 標準 | 進階 |
|---|---|---|
| Layer Count | 50L | 60L |
| Layer to Layer Registration | +/-4mils | +/-2mils |
| 描述 | 標準 | 進階 |
|---|---|---|
| Min. Drill Size | 6mils | 5mils |
| Min. Hole to Hole Pitch | 16mils(0.45mm) | 14mils(0.35mm) |
| True position Tolerance | +/-3mils | +/-2mils |
| Slot Diameter Tolerance | +/-3mils | +/-2mils |
| Min gap from PTH to track inner layers | 5mils | 4mils |
| Min. PTH edge to PTH edge space | 8mils | 6mils |
| 描述 | 標準 | 進階 |
|---|---|---|
| Max. Aspect Ratio | 30:1 | 35:1 |
| Cu Thickness in Through hole | 0.8-1.5 mils | 2 oz |
| Plated hole size tolerance | +/-2mils | +/-1.5mils |
| NPTH hole tolerance | +/-2mils | +/-1mils |
| Min. Via in pad Fill hole size | 6mils | 4mils |
| Via in pad Fill Material | Epoxy resin/Copper paste | Epoxy resin/Copper paste |
| 描述 | 標準 | 進階 |
|---|---|---|
| Min. Trace/Space | 2mils / 2mils | 2mils / 2mils |
| Min. pad over drill size | 6mils | 4mils |
| Max. Copper thickness | 12 oz | 18 oz |
| Line/ pad to board edge | 8mils | 6mils |
| Line Tolerance | +/-15% | +/-8% |
| 描述 | 標準 | 進階 |
|---|---|---|
| HASL | 50-1000u” | 50-1000u” |
| HASL+Selective Hard gold | Yes | Yes |
| OSP | 8-20u” | 8-20u” |
| Selective ENIG+OSP | Yes | Yes |
| ENIG(Nickel/Gold) | 80-200u”/2-9 u” | 250u”/ 10u” |
| Immersion Silver | 6-18u” | 6-18u” |
| Hard Gold for Tab | 10-80u” | 10-80u” |
| Immersion Tin | 30u”min. | 30u” min. |
| ENEPIG (Ni/Pd/Au) | 125u"/4u"/1u” min. | 150u"/8u"/2u” min. |
| Soft Gold (Nickel/ Gold) | 200u”/ 20u”min. | 200u”/ 20u” |
| 描述 | 標準 | 進階 |
|---|---|---|
| S/M Thickness | 0.4mils min. | 2mils max. |
| Solder dam width | 4mils | 3mils |
| S/M registration tolerance | +/-1.5mils | +/-1mils |
| S/M over line | 3.5mils | 2mils / 2mils |
| 描述 | 標準 | 進階 |
|---|---|---|
| Min. Space to SMD pad | 6mils | 4mils |
| Min. Stroke Width | 6mils | 5mils |
| Min. Space to Copper pad | 6mils | 4mils |
| Standard Color | White or Yellow | N/A |
| 描述 | 標準 | 進階 |
|---|---|---|
| Max. Test Points | 30000 Points | 30000 Points |
| Smallest SMT Pitch | 16mils(0.45mm) | 12mils(0.3mm) |
| Smallest BGA Pitch | 10mils(0.3mm) | 6mils(0.15mm) |
| 描述 | 標準 | 進階 |
|---|---|---|
| Min. Rout to copper space | 8mils | 4mils |
| Rout tolerance | +/-4mils | +/-3mils |
| 描述 | 標準 | 進階 |
|---|---|---|
| Conductor to center line | 15mils | 15mils |
| X&Y Position Tolerance | +/-4mils | +/-3mils |
| Score Anger | 30º/45º | 30º/45º |
| Score Web | 10mils min. | 8mils min. |
| 描述 | 標準 | 進階 |
|---|---|---|
| bevel anger | 20-71º | 20-71º |
| Bevel Dimensional Tolerance | +/-10mils | +/-10mils |
| 描述 | 標準 | 進階 |
|---|---|---|
| Impedance controll | +/-5% | +/-5% |