盲埋孔板

盲埋孔板

描述 標準 進階
Structure 3+n+3 (9+N+9 MAX) 10+N+10
Layer Count 2~42L 50L
Min. Board thickness 0.005" (+/-10%) 0.005" (+/-10%)
Max. Board thickness 0.250" (+/-10%) 0.280" (+/-8%)
BGA Pitch 8mils (0.2mm) 6mils (0.15mm)
Min.BGA pad/space 7mils/3mils 5mils/2mils

疊構材料

描述 標準 進階
Prepreg (FR4 1067/1086/2113) Yes Yes
Prepreg (ceramics Ro4350) Yes Yes
Laser Drillable Prepreg Yes Yes
laser Drillable core (FR4, PI, PTFE, ceramics) Yes Yes
laser Drillable Min.Dielectric thickness 1.5mils 1.2mils
laser Drillable Max.Dielectric thickness 5mils 6mils

雷鑽

描述 標準 進階
Min / Max 2.5mils / 6mils 2mils / 8mils
Min via edge to via dege space 5mils 4mils
True position Tolerance +/-1mils +/-1mils

鑽孔

描述 標準 進階
Min. Drilled blind via diameter (as drilled) 6mils 4mils
Min via edge to via dege space (as drilled) 8mils 6mils

通孔設計

描述 標準 進階
Blind via aspect ratio (dielectric thickness/ Laser drill hole size) 0.8 1
Blind via plating thickness 0.3~1mils 0.3~1mils
Capture pad A/R 2mils 1.5mils
Laser via Fill Material Epoxy resin/Copper paste Epoxy resin/Copper paste
Blind via aspect ratio (as drilled) (dielectric thickness/ drilling hole size) 0.5 0.5
Blind via plating thickness (as drilled) 0.8mils 1.0mils
Capture pad A/R (as drilled) 3mils 2mils

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