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Technology Roadmap
Process |
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Material |
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Min. Dielectric Thickness |
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Max. Layer Count |
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Max. Working Panel Size |
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Max. Board Thickness |
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Min. Board Thickness |
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Min. Line/Space |
I/L |
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O/L |
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Warp |
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Min. SMD Width |
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Layer to Layer Registration |
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Finish Hole Size (min.) |
Mechanical Drill |
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Laser Drill |
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True Hole Position |
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Finish Hole Size Tolerance |
PTH |
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Non-PTH |
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Aspect Ratio |
(Board Tks /FHS) |
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Heavy Copper |
Inner Layer |
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Outer Layer |
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Buried/Blind Via |
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Plasma Desmear |
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Outline Tolerance |
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Surface Finish |
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Controlled Impedance |
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RoHS Compliant |
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