At the present time the printed circuit board (PCB)board service business demands are more intensive than ever. The management at Speedy Circuits made the decision to add the Linetech PCB assembly facility into Speedy Circuits Co. Ltd.. Its now, "Speedy Circuits total solution package for Speedy's customers. Now! Speedy will not only manufacture fast turn around bare PCBs for Speedy's customers. Speedy can now supply fast turn around PCB Assemblies as well.

Speedy's customers require bare PCBs shipped to their own assembly facility where the newly acquired PCBs will wait in line while the previous complete units have already been done and ready to ship from Speedy Circuits.
The turnkey business is not an issue as all component parts are consigned by the customer except for a few passive components. (This is the preferred method).

Please see our PCBA major equipment and capabilities list showing below.  We look forward to receiving your Gerber files and BOM for quoting purposes.  Please note Speedy can provide engineering samples for the small mass production.

Assembly major equipments list:
1.Complete CAM work Station」X/Y table-COMEB AOS-610 x2
2.High Speed SMT machine:FujiCP643E x 2
3.Multi-purpose SMT machine:Fuji QP242E x 1
4.Solderpaste printing machine:DEK265 x 1 (Automatic)
                               MPM ACCUFLEX x 2 (Semi-Automatic)
5.Solder reflow Chambers:Coceptronic HVN-155 x 1
                          Heller-1707exl x 1
                          Heller-1808exl x 1
6.PCB depanelizer:Y-S168S1SI x 1
7.Inspection and testing:Malcom Reflow checker RC-9x1
                       Solderstar Reflow Checker x1
                       Microscope x 7
                       AOI 22 *CL x 2
8.Wave soldering Oven(Tinning furnace 3.5 M) x 2 (Leadless)
9.Thru hole production line」 6M x 2
10.Touch-up and repair x 2 lines
11.Packaging: 3 M x 1
12.Tester:Checksum x 3
         ICT (De Ri) x 1
         Oscillograph x 3
         X-ray—subcon.

Capabilities 
1.PCB categories:
 Single / double sided board
 Multi-layers board
Flexible board
Rigid-Flex
Ceramic substrate
Microwave substrate
Metal substrate

2.Component specs limitations
  BGA—smallest pitch 0.30 mm
  Smallest passive—0201
  Connector—7.80 CM Max.
3.Type of components:
DIP
QFNs (PLCC)
LGAs
CSP( one kind of BGAs)

4.SMT machine accuracy:
High Speed SMT machine: +/-0.07 mm
Multi-purpose SMT machine: +/-0.04 mm