Capabilites
PCB FABRICATION CAPABILITY CHECKLIST |
CHECK ITEMS |
PCB MFR. CAPABILITY |
REMARKS |
I. Laminate |
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- Thickness |
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(DSB) minimum |
.006" thk +/- 10 % |
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(DSB) maximum |
.250"thk+/- 0.010" |
Up to 42 Layers |
(4L) minimum |
0.012" thk+/- 0.010" |
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| (6L) minimum |
0.016" thk+/- 0.010" |
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(DSB) FLEX |
3.5mil +/-0.5mils |
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- Copper weight |
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minimum |
0.3 oz +/- 5 % |
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maximum |
10 oz (finished)+/- 5 % |
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- Material |
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Standard Board |
FR4 rating / CEM3 |
Asia Chem,Nanya
,Tuc,ITEQ |
Burn-in Board |
High Tg ,FR410,FR408 (FR5),Polyclad 370HR ,Polyimide |
Isola, Rogers
,Getek,Arlon 85N,
Taconic ,Nelco,etc |
Flexible PCBs |
POLYimide |
Du-pont Polyimide
ThinFlex Series |
Metal Core |
ALUMinium |
CS-AL-68 |
II. Drill |
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- Smallest hole size(Mech.) |
4 +/- 1 mils |
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- Laser Drill(Smallest) |
3.5 +/- 0.5 mils |
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III. Ckt/Pattern |
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- Min. line width |
2.5 mils +/- 20 % |
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- Min. air gap |
2.5 mils +/- 20 % |
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IV. Plating req't |
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- Nickel plating |
120 to 500 u" |
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- Gold (Hard type) |
50 u" |
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- Gold (Immersion) |
10 u" (Max.) |
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Aspect Ratio |
^20: 1 |
Vias : 10 mils |
V. Board finish req't |
SMOBC HAL/ HAL (Pb-free) |
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Immersion gold/Tin/Silver |
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Carbon Ink/ENTEK(OSP) |
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Blind/Buried Vias / Vias in pads |
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Plasma desmear / positive etch back 0.5-0.7 mils |
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PMaterials and Material data sheets |
Supplie |
Model name |
Links to supplier's web site to view their Material Data Sheet |
Nan Ya |
NP-150R |
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Nan Ya |
NP-140TL
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Nan Ya |
NP-150TL |
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Nan Ya |
NP-170TL |
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tuc Taiwan |
Tuc-622-5 Tg 150C |
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tuc Taiwan |
Tuc-722-7
Tg 180C |
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ITEQ Taiwan |
IT-140 Tg 140C |
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ITEQ Taiwan |
IT-150 Tg 150C |
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ISOLA |
FR406 Tg 170C |
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ISOLA |
FR408 Tg 180C |
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ISOLA |
FR410 Tg 180C |
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Rogers |
RO 4003C |
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Rogers |
RO 4350B |
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Rogers |
RO 3003 |
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Rogers |
RT/duroid 5870/5880 |
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Rogers |
TMM 10 |
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NELCO |
N-4000-6 |
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| NELCO |
N-4000-7 |
 |
NELCO |
N-4000-13 /
N-4000-13SI |
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| NELCO |
N-4000-29 |
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ARLON |
85N |
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GETEK |
ML2000D |
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Taconic |
TLX series |
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Starting your order:
Before Speedy can begin processing your order we require the following documents and information that are numbered 1. ~ 5..
Starting Requirements:
1.Gerber Data for All Artwork Layers
2.Aperture* List or Lists for all layers.
3.Drill file in Gerber or Excellon format.
4.Prints that show:
( Print should be a hard copy, or in Gerber or HPGL format.)
Fab dimensions with tolerances.
Datum.
Hole coding.
Overall thickness.
Hole size reference with the following info. For each symbol.
Finished Hole Size.
Tolerance.
Plated vs. Non plated.
Hole quantity.
5.Special Notes or "Read Me" file that pertains to:
Color and type of soldermask.
Color of Silkscreen.
Plating thickness for Copper, Nickel and Gold
(If applicable ).
Notes for Cross sectioning or Serialization .
Controlled Impedance Requirements and tolerances if any.
Any other special requirements or instructions.
Standards & Specifications:
Speedy Circuits will build customer's PCBs to the following Standards & Specifications except as otherwise specified by (1) the Customer's Purchase Order, and (2), the notes on the Customer's fabrication drawing.
IPC-A-600 Acceptability of printed wiring boards.
IPC-RB-276 Qualification and performance specs. ( Class 2 )
IPC-D-275 Design standards for rigid printed boards.
IPC-TM-650 Test methods.
IPC-SM-840 Qualification and performance of permanent
polymer coatings.
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